Evolution Scalable Platform Modules
Cinterion’s Evolution Platform is comprised of multiple
Cinterion modules offering scalability, compatibility as well as
an easy path to future upgrades and added functionality as
technology needs expand. Portfolio benefits include maximum
flexibility, high functionality, ease of integration, as well as
backward and forward compatibility, which ensures a reliable,
high quality and cost efficient solution that preserves your
technology investment.
LGA Surface mounting
LGA solderable products
including the EES3, EGS5, EGS3 and BGS3 modules which
feature efficient and reliable LGA mounting technology along
with optimized size and performance.
The modules are based on a new advanced processor design
and the field proven and reliable Cinterion M2M software
stack. The latest chip technology enables high performance,
improved efficiency and the benefit of long-term availability.
EGS5 Wireless Module
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The EGS5 is a high-performance, open-platform module powered by the JavaTM virtual machine. It combines the advantages of easy and reliable automated manufacturing with fast design and development of customer´s application. The EGS5 cuts application development and manufacturing costs.
The EGS5 wireless module features:
- LGA 119 pads mounting technology
- GPRS Class 12 for both 86 kbps in uplink and downlink
- Quad-Band (850/9000/1800/1900 MHz)
- Java IMP-NG Virtual Machine Open Platform
- TCP/IP over AT
- USB, I2C, SPI, two serial interfaces
- Extended temperature range: -40°C to +85°C
- Radio Link Stability Monitoring (e.g. for Jamming Detection)
- Remote SIM Access
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Click here to request a full technical data sheet
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