Evolution Scalable Platform Modules
Cinterion’s Evolution Platform is comprised of multiple
Cinterion modules offering scalability, compatibility as well as
an easy path to future upgrades and added functionality as
technology needs expand. Portfolio benefits include maximum
flexibility, high functionality, ease of integration, as well as
backward and forward compatibility, which ensures a reliable,
high quality and cost efficient solution that preserves your
technology investment.
LGA Surface mounting
LGA solderable products
including the EES3, EGS5, EGS3 and BGS3 modules which
feature efficient and reliable LGA mounting technology along
with optimized size and performance.
The modules are based on a new advanced processor design
and the field proven and reliable Cinterion M2M software
stack. The latest chip technology enables high performance,
improved efficiency and the benefit of long-term availability.
EES3 Wireless Module
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As part of the scalable platform the EES3 combines the advantages of easy and reliable automated manufacturing with high-speed data rates for mobile M2M communication. Offering up to 236 kbps almost all M2M applications can benefit from EDGE coverage worldwide.
The EES3 wireless module features:
- LGA 119 pads mounting technology
- EDGE Class 12 for both 236 kbps in uplink and downlink
- GPRS Class 12 for both 86 kbps in uplink and downlink
- Quad-Band (850/9000/1800/1900 MHz)
- TCP/IP over AT
- RIL driver for MS Windows Mobile 6.1 based devices
- USB, I2C, SPI, two serial interfaces
- Extended temperature range: -40°C to +85°C
- Radio Link Stability Monitoring (e.g. for Jamming Detection)
- Remote SIM Access
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Click here to request a full technical data sheet
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