Evolution Scalable Platform Modules

Cinterion’s Evolution Platform is comprised of multiple Cinterion modules offering scalability, compatibility as well as an easy path to future upgrades and added functionality as technology needs expand. Portfolio benefits include maximum flexibility, high functionality, ease of integration, as well as backward and forward compatibility, which ensures a reliable, high quality and cost efficient solution that preserves your technology investment.

LGA Surface mounting

LGA solderable products including the EES3, EGS5, EGS3 and BGS3 modules which feature efficient and reliable LGA mounting technology along with optimized size and performance. The modules are based on a new advanced processor design and the field proven and reliable Cinterion M2M software stack. The latest chip technology enables high performance, improved efficiency and the benefit of long-term availability.

BGS3 Wireless Module

 

The BGS3 provides all necessary features for cellular M2M applications. With TCP/IP, serial interfaces and GPRS data rates up to 43 kbps a wide range of applications can be addressed. Together with the outstanding LGA technology for easy and reliable automated manufacturing the BGS3 is the first choice for customers in tracking and tracing, healthcare, POS terminals, and industrial computing. The BGS3 wireless module features: LGA 119 pads mounting technology GPRS Class 10 for 43 kbps in uplink and 86 kbps in downlink Quad-Band (850/9000/1800/1900 MHz) RIL driver for MS Windows Mobile 6.1 based devices TCP/IP over AT Two serial interfaces Extended temperature range: -40°C to +85°C Radio Link Stability Monitoring (e.g. for Jamming Detection

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